Parameter of thermal rectification in the bimaterial with interfacial cracking

Середницька, Х. І. (2021). Parameter of thermal rectification in the bimaterial with interfacial cracking. Bulletin of Taras Shevchenko National University of Kyiv. Physics and Mathematics(3), 119–122. https://doi.org/10.17721/1812-5409.2021/3.23

The phenomenon of thermal rectification in bi-material with a periodic system of gas-filled interfacial cracks has been studied. The change of thermal resistance and pressure of the crack filler under the action of tensile forces and uniform heat flow is taken into account. The gas pressure is determined from the Clapeyron-Mendeleev equation. The thermal resistance of the gas is directly proportional to the opening of the cracks and inversely proportional to the thermal conductivity of the gas. The thermo-elastic problem is reduced to nonlinear systems of singular integro-differential equations for an opening cracks and a temperature jump between the cracks faces. An analytical-numerical iterative procedure is proposed to solve the system of singular integro-differential equations. The parameter of thermal rectification is determined and its dependence on the applied on the thermal and mechanical loads, thermal conductivity and mass of the gas and the interfacial cracking factor of the bi-material is analyzed. The nonlinear dependence of the thermal rectification parameter on the heat flow density and the interfacial cracking factor is established. The thermal rectification is manifested to a greater extent for higher values of heat flow and lower thermal conductivity of gas.
Pages of the article in the issue: 119 - 122
Language of the article: Ukrainian